NAND MCP
Memory Multiple Chip Package (MCP) stacks multiple chips into a single package, offering increased spatial density and performance benefits, while reducing overall power consumption. This enables designers to pack more functionality into a smaller form factor, facilitating the development of smaller electronic devices.
Memory Multiple Chip Package (MCP) stacks multiple chips into a single package, offering increased spatial density and performance benefits, while reducing overall power consumption. This enables designers to pack more functionality into a smaller form factor, facilitating the development of smaller electronic devices.
JSC Semiconductor has succeeded in successively developing new products such as mobile ram (CellularRam) and LP DDR SDRAM since recognition of its technical strength.The following are the product parameters of NAND MCP：1/2/4Gb Density；FBGA 137B,FBGA 162B,FBGA 121B etc.PKG information.
